ANN ARBOR—In response to the need for more engineers with a background in emerging technologies, the University of Michigan College of Engineering unveiled a new master’s degree program in integrated microsystems. Beginning Winter 2002, students will be able to enroll in the new master of engineering in integrated microsystems program. This innovative program offers students the opportunity to gain a deep understanding of wireless integrated microsystems (WIMS) and microelectromechanical systems (MEMS), along with other key skills in engineering and business.

WIMS and MEMS are two rapidly growing, interdisciplinary fields of engineering that focus on developing tiny information-gathering nodes. By essentially eliminating the size factor needed to gather and analyze information, WIMS and MEMS allow processing power to be integrated into almost any device. With WIMS and MEMS technology, anything that can potentially benefit from having a brain on board will be able to have one.

Over the next two decades, WIMS and MEMS applications are expected to touch nearly every aspect of our lives. Researchers at the College’s Engineering Research Center for Wireless Integrated Microsystems (ERC-WIMS) are already using WIMS and MEMS technology to develop sugar cube-sized environmental monitors that will warn people of nearby toxic substances and also to improve cochlear implants that will restore hearing to the deaf. WIMS and MEMS technology will revolutionize scientific and medical instruments, as well as create a host of smarter, smaller consumer devices.

The 30 credit-hour graduate program provides graduates with the necessary knowledge to help guide WIMS/MEMS product and process development. The curriculum combines technical know-how with coursework in product development, interdisciplinary teamwork and business management. Applicants to the program should have an undergraduate degree in engineering, chemistry, physics, biology or mathematics. Experience in the microsystems or microelectronics industry will be helpful. Recent graduates will also be eligible.

For more information, contact the Interpro Office at (734) 763-0480, or e-mail Henia Kamil at hek@umich.edu.

College of Engineeringhek@umich.edu